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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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LSM6DSOP Fiches technique(PDF) 41 Page - STMicroelectronics |
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LSM6DSOP Fiches technique(HTML) 41 Page - STMicroelectronics |
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41 / 107 page  DocID032926 Rev 5 41/107 LSM6DSOP Application hints 107 7 Application hints 7.1 LSM6DSOP electrical connections Figure 17. LSM6DSOP electrical connections 1. Leave pin electrically unconnected and soldered to PCB. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic) should be placed as near as possible to the supply pin of the device (common design practice). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the I²C/SPI interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the I²C/SPI interface. |
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