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PCMF1USB30 Fiches technique(PDF) 18 Page - Nexperia B.V. All rights reserved |
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PCMF1USB30 Fiches technique(HTML) 18 Page - Nexperia B.V. All rights reserved |
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18 / 23 page ![]() © Nexperia B.V. 2017. All rights reserved PCMFXUSB30_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 01 April 2016 18 of 23 Nexperia PCMFxUSB30 series Common-mode EMI filter for differential channels with ESD protection 9. Soldering Fig 27. Soldering footprint WLCSP5 (PCMF1USB30) WLCSP5: Solder footprint and stencil aperture PCMF1USB30 pcmf1usb30_fr solder resist opening (SR) occupied area solder land plus solder paste solder paste deposit (SP) solder land (SL) Dimensions in mm SR P 0.25 0.325 Hx 1.00 SL 0.25 SP 0.40 16-03-22 Hy 1.40 SL = SP SR detail X see detail X P P Hx Hy recommend stencil thickness: 0.1 mm |
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