PCF8811MUSLASH2DASLASH1 datasheet(2/73 Pages) PHILIPS

2 / 73 page

2004 May 17

Philips Semiconductors

Product speciﬁcation

× 128 pixels matrix LCD driver

PCF8811

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

PIN FUNCTIONS

7.1

ROW 0 to ROW 79: row driver outputs

7.2

COL 0 to COL 127: column driver outputs

7.3

VSS1 and VSS2: negative power supply rails

7.4

VDD1 to VDD3: positive power supply rails

7.5

VOTPPROG: OTP programming power supply

7.6

VLCDOUT, VLCDIN and VLCDSENSE: LCD power

supply

7.7

T1 to T5: test pads

7.8

MF2 to MF0

7.9

DS0

7.10

VOS4 to VOS0

7.11

EXT: extended command set

7.12

PS0, PS1 and PS2

7.13

D/C

7.14

R/W

7.15

7.16

SCLH/SCE

7.17

SDAH

7.18

SDAHOUT

7.19

DB7 to DB0

7.20

OSC: oscillator

7.21

RES: reset

BLOCK DIAGRAM FUNCTIONS

8.1

Oscillator

8.2

Address Counter (AC)

8.3

Display Data RAM (DDRAM)

8.4

Timing generator

8.5

Display address counter

8.6

LCD row and column drivers

ADDRESSING

9.1

Display data RAM structure

PARALLEL INTERFACE

10.1

6800 series parallel interface

SERIAL INTERFACING (SPI AND SERIAL

INTERFACE)

11.1

Serial peripheral interface

11.2

Serial interface (3-line)

I2C-BUS INTERFACE

12.1

Characteristics of the I2C-bus (Hs-mode)

12.2

I2C-bus Hs-mode protocol

12.3

Command decoder

INSTRUCTIONS

13.1

Explanation of the symbols

13.2

Initialization

13.3

Reset function

13.4

Power-save mode

13.5

Display control

13.6

Set Y address of RAM

13.7

Set X address of RAM

13.8

Set display start line

13.9

Bias levels

13.10

Set VOP value

13.11

Temperature control

LIMITING VALUES

HANDLING

DC CHARACTERISTICS

AC CHARACTERISTICS

PARALLEL INTERFACE TIMING

CHARACTERISTICS

SERIAL INTERFACE TIMING

CHARACTERISTICS

I2C-BUS INTERFACE TIMING

CHARACTERISTICS

APPLICATION INFORMATION

MODULE MAKER PROGRAMMING

22.1

VLCD calibration

22.2

Temperature coefficient selection

22.3

Seal bit

22.4

OTP architecture

22.5

Interface commands

22.6

Example of filling the shift register

22.7

Programming flow

22.8

Programming specification

CHIP INFORMATION

BONDING PAD LOCATIONS

DEVICE PROTECTION DIAGRAM

TRAY INFORMATION

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

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