VSC8504-02 datasheet(131/131 Pages) MICROSEMI

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Ordering Information

VMDS-10507 VSC8504-02 Datasheet Revision 4.2

120

Ordering Information

The VSC8504 device is offered with two operating temperature ranges. The range for VSC8504-02 is

0 °C ambient to 125 °C junction, and the range for VSC8504-05 is -40 °C ambient to 125 °C junction.

VSC8504XKS-02 and VSC8504XKS-05 are packaged in a lead(Pb)-free, 256-pin, plastic ball grid array

(BGA) with a 17 mm × 17 mm body size, 1 mm pin pitch, and 1.8 mm maximum height.

Lead(Pb)-free products from Microsemi comply with the temperatures and profiles defined in the joint

IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC

standard.

The following table lists the ordering information for the VSC8504-02 device.

Table 136 •

Ordering Information

Part Order Number

Description

VSC8504XKS-02

Lead-free, 256-pin, plastic BGA with a 17 mm × 17 mm body size, 1 mm

pin pitch, and 1.8 mm maximum height. The operating temperature is 0 °C

ambient to 125 °C junction1.

For carrier class applications, the maximum operating temperature is 110 °C junction.

VSC8504XKS-05

Lead-free, 256-pin, plastic BGA with a 17 mm × 17 mm body size, 1 mm

pin pitch, and 1.8 mm maximum height. The operating temperature is

–40 °C ambient to 125 °C junction1.

VSC8504-02 Fiches technique(PDF) 131 Page - Microsemi Corporation