Pr

eliminar

y

MBF110

Fujitsu Microelectronics, Inc.

17

Manufacturing Considerations

CAUTION: DO NOT USE ANY METAL PICKUP TOOLS WHICH WOULD CONTACT THE SENSOR DEVICE SURFACE WITHOUT

PROTECTIVE LID INSTALLED

• Surface Mount reflow temperature:

Recommended

220

°C Max reflow spike*

MaxTemp

240

°C

• Avoid any high pressure spray directly to the sensor device surface.

• Use standard handling practices for ESD sensitive devices.

• Refer to Fujitsu PCB Assembly for Biometric Sensor Guidelines.

Array Pixel Specifications:

Notes:

1) Failing rows or columns that fall on rows (0-4) or (295-299) or columns (0-4) or (295-299) are allowed to pass for the STD product due to packaging overlap at the edge of the

sensor array. Failed rows or columns at the extreme edge of the array do not affect the quality of the acquired fingerprint image.

Specification

MBF110-LP

MBF110-STD

Max Failed Pixels

10

300

Max Failed Rows

0

1 (see note 1)

Max Failed Columns

0

1 (see note 1)