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LM337M Fiches technique(PDF) 2 Page - ON Semiconductor |
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LM337M Fiches technique(HTML) 2 Page - ON Semiconductor |
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2 / 8 page ![]() LM337M 2 MOTOROLA ANALOG IC DEVICE DATA MAXIMUM RATINGS Rating Symbol Value Unit Input–Output Voltage Differential VI–VO 40 Vdc Power Dissipation PD Internally Limited W Operating Junction Temperature Range TJ 0 to +125 °C Storage Temperature Range Tstg –65 to +150 °C ELECTRICAL CHARACTERISTICS (|VI – VO| = 5.0 V, IO = 0.1; TJ = Tlow to Thigh [Note 1], Pmax per Note 2, unless otherwise noted.) Characteristics Figure Symbol Min Typ Max Unit Line Regulation (Note 3) TA = 25°C, 3.0 V ≤ |VI–VO| ≤ 40 V 1 Regline – 0.01 0.04 %/V Load Regulation (Note 3) TA = 25°C, 10 mA ≤ IO ≤ 0.5 A |VO| ≤ 5.0V |VO| ≥ 5.0V 2 Regload – – 15 0.3 15 1.0 mV %/VO Thermal Regulation 10 ms Pulse, TA = 25°C – Regtherm – 0.03 0.04 % VO/W Adjustment Pin Current 3 IAdj – 65 100 µA Adjustment Pin Current Change 2.5 V ≤ |VI–VO| ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax, TA = 25°C 1, 2 ∆IAdj – 2.0 5.0 µA Reference Voltage 3.0 V ≤ |VI–VO| ≤ 40 V, 10 mA ≤ IO ≤ 0.5 A, PD ≤ Pmax, TA = 25°C Tlow to Thigh 3 Vref –1.213 –1.20 –1.250 –1.25 –1.287 –1.30 V Line Regulation (Note 3) 3.0 V ≤ |VI–VO| ≤ 40 V 1 Regline – 0.02 0.07 %/V Load Regulation (Note 3) 10 mA ≤ IO ≤ 0.5 A |VO| ≤ 5.0 V |VO| ≥ 5.0 V 2 Regload – – 20 0.3 70 1.5 mV %/VO Temperature Stability (Tlow ≤ TJ ≤ Thigh) 3 TS – 0.6 – %/VO Minimum Load Current to Maintain Regulation (|VI–VO| ≤ 10 V) (|VI–VO| ≤ 40 V) 3 ILmin – – 1.5 2.5 6.0 10 mA Maximum Output Current |VI–VO| ≤ 15 V, PD ≤ Pmax |VI–VO| ≤ 40 V, PD ≤ Pmax, TJ = 25°C 3 Imax 0.5 0.1 0.9 0.25 – – A RMS Noise, % of VO TA = 25°C, 10 Hz ≤ f ≤ 10 kHz – N – 0.003 – %/VO Ripple Rejection, VO = –10 V, f = 120 Hz (Note 4) Without CAdj CAdj = 10 µF 4 RR – 66 60 77 – – dB Long Term Stability, TJ = Thigh (Note 5) TA = 25°C for Endpoint Measurements 3 S – 0.3 1.0 %/1.0 k Hrs Thermal Resistance, Junction–to–Case – R ΘJC – 7.0 – °C/W NOTES: 1. Tlow to Thigh = 0° to +125°C 2. Pmax = 7.5 W 3 Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. 4. CAdj, when used, is connected between the adjustment pin and ground. 5. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. |
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