ACT4530 datasheet(10/14 Pages) ACTIVE-SEMI

10 / 14 page

ACT4530

Rev 1.0, 19-Nov-2018

Innovative PowerTM

- 10 -

www.active-semi.com

APPLICATIONS INFORMATION

PCB Layout Guidance

When laying out the printed circuit board, the

following checklist should be used to ensure proper

operation of the IC.

1) Arrange the power components to reduce the

AC loop size consisting of CIN, VIN pin, SW pin

and the Schottky diode.

2) The high power loss components, e.g. the

controller, Schottky diode, and the inductor

should be placed carefully to make the thermal

spread evenly on the board.

3) Place input decoupling ceramic capacitor CIN as

close as possible to the VIN pin and power pad.

CIN must be connected to power GND with a

short and wide copper trace.

4) Schottky anode pad and IC exposed pad

should be placed close to ground clips in CLA

applications

5) Use “Kelvin” or “4-wire” connection techniques

from the sense resistor pads directly to the CSP

and CSN pins. The CSP and CSN traces

should be in parallel to avoid interference.

6) Place multiple vias between top and bottom

GND planes for best heat dissipation and noise

immunity.

7) Use short traces connecting HSB-CHSB-SW

loop.

8) SW pad is noise node switching from VIN to

GND. It should be isolated away from the rest

of circuit for good EMI and low noise operation.

Example PCB Layout

ACT4530 Fiches technique(PDF) 10 Page - Active-Semi, Inc