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GD25B64CSIG Fiches technique(PDF) 45 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25B64CSIG Fiches technique(HTML) 45 Page - GigaDevice Semiconductor (Beijing) Inc. |
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45 / 57 page ![]() 3.3V Uniform Sector Dual and Quad Serial Flash GD25B64C 45 8. ELECTRICAL CHARACTERISTICS 8.1. POWER-ON TIMING Vcc(max) Vcc(min) VWI tVSL Chip Selection is not allowed Device is fully accessible Time Table6. Power-Up Timing and Write Inhibit Threshold Symbol Parameter Min Max Unit tVSL VCC (min) To CS# Low 1.8 ms VWI Write Inhibit Voltage 1.5 2.5 V 8.2. INITIAL DELIVERY STATE The device is delivered with the memory array erased: all bits are set to 1(each byte contains FFH). The Status Register bits are set to 0, except DRV0 bit (S21) and QE bit (S9) are set to 1. 8.3. ABSOLUTE MAXIMUM RATINGS Table7. Absolute Maximum Ratings Parameter Value Unit Ambient Operating Temperature -40 to 85 ℃ Storage Temperature -65 to 150 ℃ Applied Input/Output Voltage -0.6 to VCC+0.4 V Transient Input/Output Voltage (note: overshoot) -2.0 to VCC+2.0 V VCC -0.6 to 4.2 V |
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