Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

© 2017 Eaton

All Rights Reserved

Printed in USA

Publication No. 4451- BU-SB15121

September 2017

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

FPT705

Dual conductor, high current power inductors

Technical Data 4451

Effective September 2017

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products.

Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.

t

Time 25°C to Peak

Time

25°C

Preheat

A

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (Tsmin)

100°C

150°C

• Temperature max. (Tsmax)

150°C

200°C

• Time (Tsmin to Tsmax) (ts)

60-120 Seconds

60-120 Seconds

Average ramp up rate Tsmax to Tp

3°C/ Second Max.

3°C/ Second Max.

Time at liquidous (tL)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (TP)*

Table 1

Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)

20 Seconds**

30 Seconds**

Average ramp-down rate (Tp to Tsmax)

6°C/ Second Max.

6°C/ Second Max.

Time 25°C to Peak Temperature

6 Minutes Max.

8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1 - Standard SnPb Solder (Tc)

Package

Thickness

Volume

<350

Volume

≥350

<2.5mm)

235°C

220°C

≥2.5mm

220°C

220°C

Table 2 - Lead (Pb) Free Solder (Tc)

Package

Thickness

Volume

<350

Volume

350 - 2000

Volume

>2000

<1.6mm

260°C

260°C

260°C

1.6 – 2.5mm

260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C