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INMP401ACEZ-R0 Fiches technique(PDF) 12 Page - TDK Electronics |
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INMP401ACEZ-R0 Fiches technique(HTML) 12 Page - TDK Electronics |
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12 / 14 page ![]() INMP401 OUTLINE DIMENSIONS Figure 10. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV] 4.72 × 3.76 × 1.00 mm Body Dimensions shown in millimeters Figure 11. Package Marking Specification (Top View) 3.86 3.76 3.66 4.82 4.72 4.62 BOTTOM VIEW TOP VIEW SIDE VIEW 0.90 DIA. (PINS 1, 5, 6) 1 3 2 4 5 6 2.62 BSC 3.30 REF 1.10 DIA. 1.68 DIA. 0.25 DIA. (THRU HOLE) 0.79 BSC 2.54 BSC 1.27 BSC 1.10 1.00 0.90 0.24 REF 0.73 REF 1.20 BSC 2.40 BSC 0.68 REF 0.61 REF 0.70 DIA. (PINS 2, 4) 3.14 REF 4.10 REF REFERENCE CORNER PIN 1 YYXXXX 401 LOT TRACEABILITYCODE PIN 1 INDICATION PART NUMBER DATECODE Page 12 of 14 Document Number: DS-INMP401-00 Revision: 1.0. |
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