FENG-JUI TECHNOLOGY CO., LTD

SLIM INDUCTOR-RoHS

Your Perfect Inductor

Rev.1701

GENERAL CHARACTERISTICS

1. Operating temperature range: -40 TO + 105 (Includes temperature when the coil is heated)

℃

2. External appearance: On visual inspection, the coil has no external defects.

3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y

withstanding at below conditions.

Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec.

4. Insulating resistance: Over 100MΩ at 100V D.C. between coil and core.

5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core.

6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6/ (

℃

-25~+80 ).

℃

7. Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95%

relative humidity at 40 ±2 and 1 hour drying under normal condition.

℃

8. Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at

sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes.

9. Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G) shock

attitude upon a rubber block method shock testing machine, in three different orientations.

10. Resistance to Soldering Heat: 260 , 10 seconds(See attached recomm

℃

end reflow)

11. Storage environment: Storage condition: Temperature Range: 10

~ 35

(Generally: 21

~ 31 ) ,

℃℃

℃℃

Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range:

-35

~ 85

, Humidity Range: 50% ~ 95% RH

℃℃

12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use.

13. Reflow profile recommend:

10

60

300

250

200

150

100

50

0

T (s

300

24 0

18 0

12 0

60

0

L e a d -f re e h e a t e n d u ra n ce t e s t

245℃ Peak

230℃

40

170±10℃,60-120S

300

250

200

150

100

50

0

T(s)

300

240

180

120

60

0

Lead-free the recommended reflow condition