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AL5817 Fiches technique(PDF) 4 Page - Diodes Incorporated |
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AL5817 Fiches technique(HTML) 4 Page - Diodes Incorporated |
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4 / 13 page ![]() AL5817 Document number: DS40391 Rev. 3 - 2 4 of 13 www.diodes.com August 2018 © Diodes Incorporated AL5817 ESD Ratings Symbol Parameter Rating Unit VESD Human-Body Model (HBM) 2000 V Charged-Device Model (CDM) 1000 Recommended Operating Conditions Symbol Parameter Min Max Unit VVCC Supply Voltage Range Relative to GND Pin 4.5 60 V VOUT OUT Voltage Range 0 4 V IOUT OUT Pin Current 0 15 mA VVSET VSET Pin Operating Input Voltage Range 0 0.6 V TJ Operating Junction Temperature Range -40 +125 °C TA Operating Ambient Temperature -40 +105 °C Thermal Information (Notes 5 and 6) Symbol Parameter Rating Unit θJA Junction-To-Ambient Thermal Resistance 90 °C/W θJC Junction-To-Case (Top) Thermal Resistance 39 °C/W Note: 5. Dominant conduction path via exposed pad. 6. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed. |
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