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ML7021 Fiches technique(PDF) 22 Page - OKI electronic componets |
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ML7021 Fiches technique(HTML) 22 Page - OKI electronic componets |
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22 / 24 page ![]() 1Semiconductor ML7021 22 PACKAGE DIMENSIONS (Unit : mm) SSOP28-P-485-0.65-K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Oki Electric Industry Co., Ltd. Rev. No./Last Revised Epoxy resin 42 alloy Solder plating ( ≥5 mm) 0.39 TYP. 3/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). |
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