TRIO-PS-2G/1AC/12DC/10

106980_en_00

PHOENIX CONTACT

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2Table of contents

1

Description ..................................................................................................................................1

2

Table of contents .........................................................................................................................2

3

Ordering data ..............................................................................................................................4

4

Technical data .............................................................................................................................5

5

Safety regulations and installation notes ................................................................................... 11

6

High-voltage test (HIPOT) ......................................................................................................... 12

6.1

High-voltage dielectric test (dielectric strength test) and why must it be performed? .................................... 12

6.2

High-voltage dielectric test during the manufacturing process...................................................................... 12

6.3

High-voltage dielectric test performed by the customer ................................................................................ 12

6.4

Performing high-voltage testing .................................................................................................................... 12

7

Basic circuit diagram ................................................................................................................. 13

8Structure .................................................................................................................................................................13

9

Cooling ...................................................................................................................................... 14

10

Mounting position and dimensions ............................................................................................ 14

10.1

Mounting position ......................................................................................................................................... 14

10.2

Device dimensions ....................................................................................................................................... 15

11

Mounting/removal...................................................................................................................... 16

11.1

Assembly ...................................................................................................................................................... 16

11.2

Removal ....................................................................................................................................................... 16

12

Device connection terminal blocks .................................................................................................................16

12.1

Push-in connection technology ..................................................................................................................... 16

13

Input .......................................................................................................................................... 17

13.1

Position of input terminals ............................................................................................................................. 17

13.2

Protection of the primary side ....................................................................................................................... 17

14

Output ....................................................................................................................................... 18

14.1

Position of output terminals........................................................................................................................... 18

14.2

Protection of the secondary side................................................................................................................... 18

14.3

Output characteristic curve ........................................................................................................................... 18

15

Dynamic boost .......................................................................................................................... 19

16

Signaling .................................................................................................................................................................19

16.1

DC OK-LED .................................................................................................................................................. 19

16.2

Floating signal contact .................................................................................................................................. 19