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AD9858FDPCB Fiches technique(PDF) 31 Page - Analog Devices |
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AD9858FDPCB Fiches technique(HTML) 31 Page - Analog Devices |
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31 / 32 page ![]() AD9858 Rev. A | Page 31 of 32 OUTLINE DIMENSIONS 0.27 0.22 0.17 1 25 26 49 76 100 75 50 14.00 SQ 16.00 SQ 0.50 BSC 1.05 1.00 0.95 0.15 0.05 0.75 0.60 0.45 SEATING PLANE 1.20 MAX TOP VIEW (PINS DOWN) 0.20 0.09 7° 3.5° 0° 9.50 SQ COPLANARITY 0.08 1 25 26 49 76 100 75 50 BOTTOM VIEW COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD Figure 40. 100-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/EP] (SV-100) Dimensions shown in millimeters WARNING EPAD (thermal slug) must be attached to ground plane for some other large metal mass for thermal transfer. Failure to do so may cause excessive die temperature rise and damage to the device. ORDERING GUIDE Models Temperature Range Package Description Package Option AD9858BSV –40°C to +85°C 100-Lead EPAD SV-100 AD9858PCB 25°C Generic Evaluation Board AD9858FDPCB 25°C Fractional-Divide Evaluation Board AD9858TLPCB 25°C Translation Loop Evaluation Board |
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