| Moteur de recherche de fiches techniques de composants électroniques |
|
SC16C652B Fiches technique(PDF) 39 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
SC16C652B Fiches technique(HTML) 39 Page - NXP Semiconductors |
|
39 / 44 page ![]() Philips Semiconductors SC16C652B Dual UART with 32-byte FIFOs and IrDA encoder/decoder Product data Rev. 03 — 10 December 2004 39 of 44 9397 750 14452 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Fig 19. HVQFN32 package outline (SOT617-1). 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 3.5 e2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT617-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT617-1 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |