AD9739-R2-EBZ datasheet(9/50 Pages) AD

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Data Sheet

AD9739

Rev. E | Page 9 of 50

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect To

Rating

VDDA

VSSA

−0.3 V to +3.6 V

VDD33

VSS

−0.3 V to +3.6 V

VDD

VSS

−0.3 V to +1.98 V

VDDC

VSSC

−0.3 V to +1.98 V

VSSA

VSS

−0.3 V to +0.3 V

VSSA

VSSC

−0.3 V to +0.3 V

VSS

VSSC

−0.3 V to +0.3 V

DACCLK_P, DACCLK_N

VSSC

−0.3 V to VDDC + 0.18 V

DCI, DCO, SYNC_IN,

SYNC_OUT

VSS

−0.3 V to VDD33 + 0.3 V

LVDS Data Inputs

VSS

−0.3 V to VDD33 + 0.3 V

IOUTP, IOUTN

VSSA

−1.0 V to VDDA + 0.3 V

I120, VREF

VSSA

−0.3 V to VDDA + 0.3 V

IRQ, CS, SCLK, SDO,

SDIO, RESET

VSS

−0.3 V to VDD33 + 0.3 V

Junction Temperature

150°C

Storage Temperature

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

JA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

Unit

160-Ball CSP_BGA

31.2

7.0

°C/W1

1 With no airflow movement.

ESD CAUTION

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