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EMIF10-COM01F2 Fiches technique(PDF) 5 Page - STMicroelectronics |
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EMIF10-COM01F2 Fiches technique(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() EMIF10-COM01F2 5/7 Figure 10: Ordering Information Scheme Figure 11: FLIP-CHIP Package Mechanical Data Figure 12: Foot print recommendations Figure 13: Marking EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm = 3: Leadfree Pitch = 400µm, Bump = 250µm 2.42mm ± 50µm 315µm ± 50 500µm ± 50 650µm ± 65 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter 545 400 x y x w z w All dimensions in µm E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = packaging location |
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