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FH35C Fiches technique(PDF) 8 Page - Hirose Electric |
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FH35C Fiches technique(HTML) 8 Page - Hirose Electric |
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8 / 12 page ![]() 8 FH35C Series●0.3 mm pitch, 0.9 mm height, back flip type dual-sided FPC connector ■Temperature Profile Applicable Conditions Reflow System : Far-infrared, hot-air reflow Reflow chamber atmosphere : Air Solder : Paste type Sn/3.0 Ag/0.5 Cu (M705-GRN360-K2-V; Senju Metal Industry Co., Ltd.) Test PCB : PCB material and size Glass epoxy 25 × 50 × 0.8 mm Land dimensions 0.3 × 0.65, 0.3 × 0.8 mm Metal Mask : Thickness : 0.1 mm Opening dimension 0.23 × 0.55, 0.23 × 0.65 mm The provided temperature profile shown is based on the conditions described above. Variations may occur due to the changing conditions such as solder paste types, different manufacturers, PCB size, and other soldering materials. Please check the mounting conditions before use. |
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