STC5NF30V datasheet(2/8 Pages) STMICROELECTRONICS

2 / 8 page

STC5NF30V

2/8

THERMAL DATA

(*) When Mounted on FR-4 board with 1 inch2 pad, 2 oz of Cu and t

[ 10 sec

(**) When Mounted on minimum recommended footprint

ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)

OFF

ON (*)

DYNAMIC

Rthj-pcb

Tstg

Thermal Resistance Junction-PCB (**)

Thermal Resistance Junction-PCB (*)

Operating Junction Temperature

Storage temperature

Max

100

83.5

-55 to 150

°C/W

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

V(BR)DSS

Drain-source

Breakdown Voltage

ID = 250 µA, VGS = 0

IDSS

Zero Gate Voltage

Drain Current (VGS = 0)

VDS = Max Rating

VDS = Max Rating TC = 125°C

µA

IGSS

Gate-body Leakage

Current (VDS = 0)

VGS = ± 12V

±100

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VGS(th)

Gate Threshold Voltage

VDS = VGS

ID = 250 µA

0.6

RDS(on)

Static Drain-source On

Resistance

VGS = 4.5 V

ID = 2.5 A

VGS = 2.7 V

ID = 2.5 A

0.027

0.031

0.035

Ω

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

gfs (*)

Forward Transconductance

VDS=15 V

ID = 2.5 A

9.5

Ciss

Coss

Crss

Input Capacitance

Output Capacitance

Reverse Transfer

Capacitance

VDS = 15V f = 1 MHz, VGS = 0

460

200

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