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TDA1308AT Fiches technique(PDF) 10 Page - NXP Semiconductors |
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TDA1308AT Fiches technique(HTML) 10 Page - NXP Semiconductors |
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10 / 16 page ![]() 2002 Jul 19 10 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 95-02-04 99-12-27 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b2 050G01 MO-001 SC-504-8 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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