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ADRF6516ACPZ-R7 Fiches technique(PDF) 29 Page - Analog Devices |
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ADRF6516ACPZ-R7 Fiches technique(HTML) 29 Page - Analog Devices |
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29 / 29 page ![]() Data Sheet ADRF6516 Rev. C | Page 29 of 29 OUTLINE DIMENSIONS 3.25 3.10 SQ 2.95 0.80 0.75 0.70 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.50 0.40 0.30 0.25 MIN COMPLIANT TO JEDEC STANDARDS MO-220-WHHD SEATING PLANE EXPOSED PAD SIDE VIEW PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 62. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.75 mm Package Height (CP-32-7) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADRF6516ACPZ-R7 −40°C to +85°C 32-Lead LFCSP, 7”Tape and Reel CP-32-7 ADRF6516-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2010–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09422-0-8/17(C) |
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