AD8363ACPZ-R2 datasheet(29/29 Pages) AD

29 / 29 page

Data Sheet

AD8363

Rev. B | Page 29 of 29

OUTLINE DIMENSIONS

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC-3.

0.65

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.40

2.35 SQ

2.30

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 62. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-20)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering Quantity

AD8363ACPZ-R2

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

250

AD8363ACPZ-R7

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

1,500

AD8363ACPZ-WP

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

AD8363-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D07368-0-3/15(B)

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