LTM8049

2

8049fa

For more information www.linear.com/LTM8049

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

SYNCn, FBXn ..............................................................5V

SSn ..........................................................................2.5V

SHAREn ......................................................................2V

Maximum Internal Temperature............................ 125°C

Maximum Solder Temperature..............................260°C

Storage Temperature.............................. –55°C to 125°C

(Note 1)

TOP VIEW

BGA PACKAGE

77-LEAD (15mm × 9mm × 2.42mm)

BANK 3

RUN2

SS2

SYNC2

RT2

RT1

SYNC1

SHARE1

SS1

RUN1

BANK 2

BANK 1

GND

BANK 5

FBX2

BANK 7

BANK 6

FBX1

BANK 4

A

B

C

D

E

F

G

H

J

K

L

7

6

5

4

3

2

1

SHARE2

CLKOUT1

PG1

PG2

CLKOUT2

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM8049EY#PBF

SAC305 (RoHS)

LTM8049Y

e1

BGA

3

–40°C to 125°C

LTM8049IY#PBF

LTM8049IY

SnPb (63/37)

LTM8049

e0

* Device temperature grade is indicated by a label on the shipping container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• This product is not recommended for second side reflow. For more

information, go to www.linear.com/BGA-assy

• Recommended BGA PCB Assembly and Manufacturing Procedures:

www.linear.com/BGA-assy

• BGA Package and Tray Drawings: www.linear.com/packaging

• This product is moisture sensitive. For more information, go to:

www.linear.com/BGA-assy

http://www.linear.com/product/LTM8049#orderinfo