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AS7C164-20JC Fiches technique(PDF) 6 Page - Alliance Semiconductor Corporation

No de pièce AS7C164-20JC
Description  5V 8K X 8 CMOS SRAM
PDF  8 Pages
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Fabricant  ALSC [Alliance Semiconductor Corporation]
Site Internet  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS7C164-20JC Fiches technique(HTML) 6 Page - Alliance Semiconductor Corporation

  AS7C164-20JC Datasheet HTML 1Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 2Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 3Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 4Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 5Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 6Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 7Page - Alliance Semiconductor Corporation AS7C164-20JC Datasheet HTML 8Page - Alliance Semiconductor Corporation  
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1During VCC power-up, a pull-up resistor to VCC on CE1 is required to meet ISB specification.
2
This parameter is sampled, but not 100% tested.
3
For test conditions, see AC Test Conditions, Figures A, B, and C.
4tCLZ and tCHZ are specified with CL = 5pF as in Figures B or C. Transition is measured ±500mV from steady-state voltage.
5
This parameter is guaranteed, but not 100% tested.
6WE is High for read cycle.
7CE1 and OE are Low and CE2 is High for read cycle.
8
Address valid prior to or coincident with CE1 transition Low and CE2 transition High.
9
All read cycle timings are referenced from the last valid address to the first transitioning address.
10 CE1 or WE must be High or CE2 Low during address transitions. Either CE or WE asserting high terminates a write cycle.
11 All write cycle timings are referenced from the last valid address to the first transitioning address.
12 CE1 and CE2 have identical timing.
13 2V data retention applies to the commercial operating range only.
14 C = 30pF, except on High Z and Low Z parameters, where C = 5pF.
Parameter
Symbol
Test conditions
Min
Max
Unit
VCC for data retention
VDR
VCC = 2.0V
CE1
≥ V
CC–0.2V or
CE2
≤ 0.2V
2.0
–
V
Data retention current
ICCDR
–60
µA
Chip enable to data retention time
tCDR
0–
ns
Operation recovery time
tR
tRC
–ns
VCC
CE1
tR
tCDR
Data retention mode
VCC
VCC
VDR ≥ 2.0V
VIH
VIH
VDR
CS2
tR
tCDR
VIH
VIH
VDR
-Output load: see Figure B or Figure C.
- Input pulse level: GND to 3.0V. See Figure A.
- Input rise and fall times: 2 ns. See Figure A.
- Input and output timing reference levels: 1.5V.
10%
90%
10%
90%
GND
+3.0V
Figure A: Input pulse
2ns
255
Ω
C(14)
480
Ω
DRXW
GND
+5V
Figure B: 5V Output lo
DG
255
Ω
C(14)
320
Ω
DRXW
GND
+5V
Figure C: 3.3V Output load
168
Ω
Thevenin Equivalent:
DRXW
+1.728V (5V)



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