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MP4060GS Fiches technique(PDF) 4 Page - Monolithic Power Systems |
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MP4060GS Fiches technique(HTML) 4 Page - Monolithic Power Systems |
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4 / 25 page ![]() MP4060—TRIAC Dimmable PFC, PSC LED Controller for 200-265VAC LEDs MP4060 Rev. 1.0 www.MonolithicPower.com 4 5/27/2015 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. PACKAGE REFERENCE MULT ZCD VCC BD COMP GND S D 1 2 3 4 8 7 6 5 TOP VIEW MULT ZCD VCC DAMP BD 1 2 3 4 5 10 9 8 7 6 COMP GND DIM S D TOP VIEW SOIC-8 MSOP-10 ABSOLUTE MAXIMUM RATINGS (1) VCC pin voltage..........................-0.3 V to +30 V Low-side control MOSFET drain to source Voltage VDS .................................-0.3 V to +30 V DAMP voltage .........................-0.3 V to +16.5 V ZCD current ...............................-5 mA to +5 mA Other analog inputs and outputs-0.3 V to +6.5 V Continuous power dissipation (TA = +25°C) (2) SOIC-8...................................................... 1.3 W MSOP-10 ................................................ 0.83 W Lead temperature .....................................260°C Storage temperature................ -65°C to +150°C Recommended Operating Conditions (3) Supply voltage VCC........................11 V to 27 V Operating junction temp(TJ). .... -40°C to +125°C Thermal Resistance (4) θJA θJC SOIC-8 ................................... 96 ...... 45... °C/W MSOP-10 .............................. 150 ..... 65... °C/W NOTES: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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