| Moteur de recherche de fiches techniques de composants électroniques |
|
MPQ2918GL Fiches technique(PDF) 4 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MPQ2918GL Fiches technique(HTML) 4 Page - Monolithic Power Systems |
|
4 / 32 page ![]() MPQ2918 – 4V - 40V, CURRENT MODE, SYNC, STEP-DOWN CONTROLLER MPQ2918 Rev. 1.01 www.MonolithicPower.com 4 8/17/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Input supply voltage (VIN)............................. 65V BST supply voltage (VBST).................. VIN + 6.5V SW ..................................................-0.3V to 65V EN/SYNC..................................................... 55V BST - SW.................................................... 6.5V Supply voltage (VCC1) ............................... 6.5V External supply voltage (VCC2)................... 15V SENSE + / - ................................................. 28V Differential sense (SENSE+ to SENSE-) ............ .....................................................-0.7V to +0.7V TG...............................VSW - 0.3V to VBST + 0.3V BG ................................... -0.3V to VCC1 + 0.3V All other pins ................................-0.3V to +6.5V Continuous power dissipation (TA = +25°C) (2) TSSOP-20 EP............................................ 3.1W QFN-20 (3mmx4mm)................................. 2.6W Junction temperature ................................150°C Lead temperature .....................................260°C Storage temperature................ -65°C to +175°C Recommended Operating Conditions Supply voltage (VIN) ............................4V to 40V Output voltage (VOUT)................................. ≤25V Supply voltage for (VCC2) ...............4.7V to 12V Operating junction temp. (TJ). .. -40°C to +125°C Thermal Resistance (3) θJA θJC TSSOP-20 EP ........................ 40 ....... 8.... °C/W QFN-20 (3mmx4mm).............. 48 ...... 10... °C/W NOTES: 1) Absolute maximum are rated under room temperature unless otherwise noted. Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7, 4-layer PCB. |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |