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LP6284 Fiches technique(PDF) 5 Page - Lowpower Semiconductor inc |
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LP6284 Fiches technique(HTML) 5 Page - Lowpower Semiconductor inc |
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5 / 9 page ![]() Preliminary Datasheet LP6284 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 5 of 9 LP6284–00 Version 0.0 AUG.-2016 Absolute Maximum Ratings Note 1 VIN, LDOI --------------------------------------------------------------------------------------------------------- -0.3V to +6.5V LX -------------------------------------------------------------------------------------------------------------------- -0.3V to +16V LDOO -------------------------------------------------------------------------------------------------------------- −0.3V to (VLDOI + 0.3V) VGHM, VGH, DRN --------------------------------------------------------------------------------------------- −0.3V to 30V AVDD ------------------------------------------------------------------------------------------------------------- −0.3V to 16 OPO, OPI, DRVP ----------------------------------------------------------------------------------------------- −0.3V to (VAVDD + 0.3V) VDPM, VFLK, DLY, ������������������������������,VDET,SS,COMP,FB,FBP --------------------------------------------- −0.3Vto(VIN+0.3V) Operating Junction Temperature Range (TJ) ---------------------------------------------------------- -40 ℃ to 150℃ Operation Ambient Temperature Range---------------------------------------------------------------- -40°C to +85°C Storage Temperature Range ------------------------------------------------------------------------------ -65°C to +150°C Maximum Soldering Temperature (at leads, 10sec) ------------------------------------------------- +260°C Maximum Junction Temperature ------------------------------------------------------------------------- 150°C Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Information Thermal Resistance QFN-24 4x4, θ JA ---------------------------------------------------------------------------------------------- 56°C/W ESD Susceptibility HBM(Human Body Mode) Note 2 ---------------------------------------------------------------------- 2KV MM(Machine Mode) Note 3 ------------------------------------------------------------------------------ 200V Note 2. The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The testing is done according JEDEC. Note 3. Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testing is done according JEDEC. |
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