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PCF8591 Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCF8591 Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 28 page ![]() 2003 Jan 27 21 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 16 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT38-4 92-11-17 95-01-14 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 |
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