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ADG201S Fiches technique(PDF) 6 Page - Analog Devices |
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ADG201S Fiches technique(HTML) 6 Page - Analog Devices |
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6 / 7 page ![]() 5.1 HTRB is not applicable for this drawing. 5.2 Burn-in is per MIL-STD-883 Method 1015 test condition B or C. 5.3 Steady state life test is per MIL-STD-883 Method 1005. 6.1 Full WLA per MIL-STD-883 TM 5007 is not available for this product fabricated in a QMLQ wafer process facility. SEM Inspection only is available per MIL-STD-883, TM2018. |
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