23026HT pdf, 23026HT Description, 23026HT Fiches technique, 23026HT view ::: ALLDATASHEET :::

No de pièce	23026HT

Description	High-Temp 200째C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

Taille du fichier	844.04 Kbytes

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Fabricant	ARIES [Aries Electronics, Inc.]

Site Internet	http://www.arieselec.com

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Numéro de pièce similaire - 23026HT

Fabricant	No de pièce	Fiches technique	Description
Aries Electronics, Inc.	23026	803Kb / 1P	Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
PHOENIX CONTACT	2302609	96Kb / 7P	Cable - FLK 50/EZ-DR/D37SUB/100/Y81P-O 09/12/2020
PHOENIX CONTACT	2302612	303Kb / 8P	FLK 50/EZ-DR/D37SUB/200/Y81P-O - Cable
Huber+Suhner, Inc.	23026120	172Kb / 2P	COAXIAL CONNECTOR, SMA, 50 Ohm, Straight cable plug (male)
PHOENIX CONTACT	2302654	103Kb / 3P	System cable for Mitsubishi Electric MELSEC Q X81, MELSEC A1S X81, MELSEC A AX82, cable length 1.0 m

Fabricant	No de pièce	Fiches technique	Description
Abracon Corporation	AXS-1147-02-02	419Kb / 1P	CRYSTAL TEST & BURN IN SOCKET 08.21.09
	AXS-1155-04-01	410Kb / 1P	CRYSTAL TEST & BURN-IN SOCKET 07.10.09
	AXS-2520-04-01	403Kb / 1P	CRYSTAL OSCILLATOR TEST & BURN IN SOCKET 07.10.09
Aries Electronics, Inc.	10002	716Kb / 1P	High-Temp Universal ZIF DIP Burn-in & Test Socket
	23026	803Kb / 1P	Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	24005	1Mb / 2P	Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, 關BGA and Bumped Die Devices
Abracon Corporation	AXS-7050-06-13	411Kb / 1P	CRYSTAL OSCILLATOR TEST & BURN IN SOCKET 07.13.09
	AXS-2520-04-05	402Kb / 1P	Suitable for high temperature burn-in test 07.10.09
	AXS-2520-04-07	391Kb / 1P	Suitable for high temperature burn-in test 07.10.09
	AXS-5032-04-04	404Kb / 1P	Suitable for high temperature burn-in test 07.13.09