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0015800063 Fiches technique (PDF) - Molex Electronics Ltd.

No de pièce	0015800063

Description	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

Taille du fichier	1229.86 Kbytes

Html View	1 2 3 4 5 6 7

Fabricant	MOLEX2 [Molex Electronics Ltd.]

Site Internet	http://www.molex.com

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0015800063 Fiches technique (PDF) - Molex Electronics Ltd.

Numéro de pièce similaire - 0015800063

Fabricant	No de pièce	Fiches technique	Description
Molex Electronics Ltd.	0015800063	33Kb / 2P	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

Description similaire - 0015800063

Fabricant	No de pièce	Fiches technique	Description
Molex Electronics Ltd.	0015800369	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800089	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800269	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800069	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800483	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800249	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800683	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800283	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800263	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800209	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating

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