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0010897782 Fiches technique (PDF) - Molex Electronics Ltd.

No de pièce	0010897782

Description	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 78 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Taille du fichier	432.93 Kbytes

Html View	1 2 3 4

Fabricant	MOLEX1 [Molex Electronics Ltd.]

Site Internet	http://www.molex.com

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0010897782 Fiches technique (PDF) - Molex Electronics Ltd.

Numéro de pièce similaire - 0010897782

Fabricant	No de pièce	Fiches technique	Description
Molex Electronics Ltd.	0010897780	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 78 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
	0010897781	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 78 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
	0010897781	28Kb / 2P	2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

Description similaire - 0010897782

Fabricant	No de pièce	Fiches technique	Description
Molex Electronics Ltd.	0010897542	433Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 54 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897282	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897722	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897082	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897582	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 58 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897622	433Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0010897242	432Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
	0702800488	294Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail
	0702800458	294Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail
	0702800455	294Kb / 4P	2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 94 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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