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Numéro de pièce similaire - CABGA

Fabricant	No de pièce	Fiches technique	Description
Amkor Technology	CABGA	411Kb / 2P	Silver Wirebonding 02/22
Amkor Technology	CABGA	746Kb / 2P	Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. 06/19

Fabricant	No de pièce	Fiches technique	Description
Fairchild Semiconductor	AN-5026	722Kb / 8P	Using BGA Packages
Rohm	TSSOP-B14J	90Kb / 2P	IC Packages
List of Unclassifed Man...	Q4004F312	236Kb / 10P	Electrically-isolated packages
Teccor Electronics	L6008D8TP	178Kb / 8P	Electrically-isolated packages
XP Power Limited	QSB	153Kb / 4P	Industry Standard Packages
IXYS Corporation	IXYK100N65B3D1	227Kb / 7P	International Standard Packages
IXYS Corporation	IXYK100N65C3D1	225Kb / 7P	International Standard Packages
TT Electronics.	BCN31	274Kb / 3P	Leadless Chip Packages
STMicroelectronics	LMV82X	663Kb / 32P	Tiny packages 10-Apr-2017
List of Unclassifed Man...	C30617	647Kb / 7P	Available in various packages