Features
● For surface mount application in order to optimize board space
● Low inductance
● Low profile package
● Built-in strain relief
● Glass passivated junction
● Excellent clamping capability
● Repetition Rate( duty cycle): 0.05%
● Fast response time: typical less than 1ps from 0V to BV min
● Typical ID less than 1uA above 10V
● High temperature soldering: 260oC/10 seconds at terminals
● Plastic package has Underwrites Laboratory Flammability Classification 94V-O