Overview
This chapter provides an overview of the MCF5272 microprocessor features, including the major functional components.

MCF5272 Key Features
A block diagram of the MCF5272 is shown in Figure 1-1. The main features are as follows:
• Static Version 2 ColdFire variable-length RISC processor
   — 32-bit address and data path on-chip
   — 66-MHz processor core and bus frequency
   — Sixteen general-purpose 32-bit data and address registers
   — Multiply-accumulate unit (MAC) for DSP and fast multiply operations
• On-chip memories
   — 4-Kbyte SRAM on CPU internal bus
   — 16-Kbyte ROM on CPU internal bus
   — 1-Kbyte instruction cache
• Power management
   — Fully-static operation with processor sleep and whole-chip stop modes
   — Very rapid response to interrupts from the low-power sleep mode (wake-up feature)
   — Clock enable/disable for each peripheral when not used
   — Software-controlled disable of external clock input for virtually zero power consumption (low-power stop mode)
• Two universal asynchronous/synchronous receiver transmitters (UARTs)
   — Full-duplex operation
   — Based on MC68681 dual-UART (DUART) programming model
   — Flexible baud rate generator
   — Modem control signals available (CTS and RTS)
   — Processor interrupt and wakeup capability
   — Enhanced Tx, Rx FIFOs, 24 bytes each
• Ethernet Module
   — 10 baseT capability, half or full duplex
   — 100 baseT capability, half duplex and limited throughput full duplex (MCF5272)
   — On-chip transmit and receive FIFOs
   — Off-chip flexible buffer descriptor rings
   — Media-independent interface (MII)
• Universal serial bus (USB) module
   — 12 Mbps (full speed)
   — Fully compatible with USB 1.1 specifications
   — Eight endpoints (control, bulk, interrupt Rx, isochronous)
   — Endpoint FIFOs
   — Selectable on-chip analog interface
• External memory interface
   — External glueless 8, 16, and 32-bit SRAM and ROM interface bus
   — SDRAM controller supports 16–256 Mbit devices
   — External bus configurable for 16 or 32 bits width for SDRAM
   — Glueless interface to SRAM devices with or without byte strobe inputs
   — Programmable wait state generator
• Queued serial peripheral interface (QSPI)
   — Full-duplex, three-wire synchronous transfer
   — Up to four chip selects available
   — Master operation
   — Programmable master bit rates
   — Up to 16 preprogrammed transfers
• Timer module
   — 4x16-bit general-purpose multi-mode timer
      – Input capture and output compare pins for timers 1 and 2
      – Programmable prescaler
   — 15-nS resolution at 66-MHz clock frequency
   — Software watchdog timer
   — Software watchdog can generate interrupt before reset
   — Processor interrupt for each timer
• Pulse-width modulation (PWM) unit
   — Three identical channels
   — Independent prescaler TAP point
   — Period/duty range variable
• System integration module (SIM)
   — System configuration including internal and external address mapping
   — System protection by hardware watchdog
   — Versatile programmable chip-select signals with wait-state generation logic
   — Up to three 16-bit parallel input/output ports
   — Latchable interrupt inputs with programmable priority and edge triggering
   — Programmable interrupt vectors for on-chip peripherals
• Physical layer interface controller (PLIC)
   — Allows connection using general circuit interface (GCI) or interchip digital link (IDL) physical layer protocols for 2B + D data
   — Three physical interfaces
   — Four time-division multiplex (TDM) ports
• IEEE 1149.1 boundary-scan test access port (JTAG) for board-level testing
• Operating voltage: 3.3 V ±0.3 V
• Operating temperature: 0 –70°C
• Operating frequency: DC to 66 MHz, from external CMOS oscillator
• Compact ultra low-profile 196 ball-molded plastic ball-grid array package (PGBA)