Description
The EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering.
The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. Thats why EMIF02-MIC06F3 is a very small device.
Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.

Features
■ 2-line symmetrical low-pass filter
■ Lead-free package
■ Very low PCB space consuming: < 1.5 mm2
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression IEC 61000-4-2 level 4
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through integration and wafer level packaging

Application
■ Mobile phones (differential microphone filtering and ESD protection)