Features
• package: white SMT package, colorless clear resin
• feature of the device: top mount or reverse mount; ideal for extremely flat backlight
• wavelength: 570 nm (green)
• viewing angle: Lambertian Emitter (120°)
• technology: InGaAlP
• optical efficiency: 4 lm/W
• grouping parameter: luminous intensity, wavelength
• assembly methods: suitable for all SMT assembly methods
• soldering methods: IR reflow soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 8 mm tape with 3000/reel, ø180 mm or 12000/reel, ø330 mm
• ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B

Applications
• coupling into light guides
• Key pad illumination
• optical indicators
• backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising)
• Interior automotive lighting (e.g. dashboard backlighting, etc.)