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TSV Fiches technique (PDF) - Amkor Technology

TSV Datasheet PDF - Amkor Technology
No de pièce TSV
Télécharger  TSV Télécharger
Taille du fichier   1779.69 Kbytes
Page   5 Pages
Fabricant  AMKOR [Amkor Technology]
Site Internet  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.

TSV Datasheet (PDF)

Go To PDF Page Télécharger Fiches technique
TSV Datasheet PDF - Amkor Technology

No de pièce TSV
Télécharger  TSV Click to download

Taille du fichier   1779.69 Kbytes
Page   5 Pages
Fabricant  AMKOR [Amkor Technology]
Site Internet  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.

TSV Fiches technique (HTML) - Amkor Technology




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À propos de Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Ces informations sont fournies à titre informatif uniquement, nous ne serons pas responsables des pertes ou dommages causés par les informations ci-dessus.




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