SSOP-V01 Fiches technique(PDF) - Amkor Technology

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SSOP-V01 Fiches technique (PDF) - Amkor Technology

SSOP-V01 Datasheet PDF - Amkor Technology


No de pièce	SSOP-V01

Télécharger	SSOP-V01 Télécharger

Taille du fichier	475.9 Kbytes

Page	2 Pages

Fabricant	AMKOR [Amkor Technology]

Site Internet	http://www.amkor.com

Logo

Description

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

SSOP-V01 Datasheet (PDF)

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Télécharger Fiches technique

SSOP-V01 Datasheet PDF - Amkor Technology


No de pièce	SSOP-V01

Télécharger	SSOP-V01 Click to download

Taille du fichier	475.9 Kbytes

Page	2 Pages

Fabricant	AMKOR [Amkor Technology]

Site Internet	http://www.amkor.com

Logo

Description	SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

SSOP-V01 Fiches technique (HTML) - Amkor Technology

SSOP-V01 Datasheet HTML 1Page - Amkor Technology

SSOP-V01 Datasheet HTML 2Page - Amkor Technology

SSOP-V01 Détails du produit

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Numéro de pièce similaire - SSOP-V01

Fabricant	No de pièce	Fiches technique	Description
List of Unclassifed Man...	SSOP-16	88Kb / 1P	16-Lead SSOP Plastic Package
Global Mixed-mode Techn...	SSOP-16	121Kb / 1P	Package Outline
	SSOP-16(209MILS)	122Kb / 1P	Package Outline
	SSOP-20	122Kb / 1P	Package Outline
	SSOP-24	121Kb / 1P	Package Outline

Description similaire - SSOP-V01

Fabricant	No de pièce	Fiches technique	Description
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
Analog Devices	RQ-16	60Kb / 1P	16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
ACCUTEK MICROCIRCUIT CO...	AK06D300-QSOP	174Kb / 4P	Quarter Size Small Outline Package QSOP DIP Adapters
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

À propos de Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Ces informations sont fournies à titre informatif uniquement, nous ne serons pas responsables des pertes ou dommages causés par les informations ci-dessus.

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