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239-75ABE-03 Fiches technique (PDF) - List of Unclassifed Manufacturers
239-75ABE-03 Datasheet PDF - List of Unclassifed Manufacturers
No de pièce 239-75ABE-03
Télécharger  239-75ABE-03 Télécharger
Taille du fichier   8044.67 Kbytes
Page   21 Pages
Fabricant  ETC [List of Unclassifed Manufacturers]
Site Internet  
Logo ETC - List of Unclassifed Manufacturers
Description BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

239-75ABE-03 Datasheet (PDF)

Go To PDF Page Télécharger Fiches technique
239-75ABE-03 Datasheet PDF - List of Unclassifed Manufacturers

No de pièce 239-75ABE-03
Télécharger  239-75ABE-03 Click to download

Taille du fichier   8044.67 Kbytes
Page   21 Pages
Fabricant  ETC [List of Unclassifed Manufacturers]
Site Internet  
Logo ETC - List of Unclassifed Manufacturers
Description BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

239-75ABE-03 Fiches technique (HTML) - List of Unclassifed Manufacturers


239-75ABE-03 Détails du produit

• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
FEATURES AND BENEFITS




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