Features
• Specifications per DLA VID V62/10602
• Full mil-temp electrical performance from -55°C to +125°C
• Controlled baseline with one wafer fabrication site and one
assembly/test site
• Full homogeneous lot processing in wafer fab
• No combination of wafer fabrication lots in assembly
• Full traceability through assembly and test by date/trace
code assignment
• Enhanced process change notification
• Enhanced obsolescence management
• Eliminates need for up-screening a COTS component
• High ESD protection on RS-485 outputs ±16.5kV HBM
- IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV
- Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM
• Specified for +125°C operation (VCC ≤ 3.6V only)
• Logic supply pin (VL) eases operation in mixed supply
systems
• Hot plug - Tx output remains tri-state during power-up
• Low Tx leakage allows >256 devices on the Bus
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 16Mbps
• Low quiescent supply current. . . . . . . . . . . . . . . 150µA (Max)
- Very low shutdown supply current . . . . . . . . . . . 1µA (Max)
• -7V to +12V Common Mode Output Voltage Range
(VCC ≤ 3.6V Only)
• Current limiting and thermal shutdown for driver overload
protection (VCC ≤ 3.6V Only)
• Tri-statable Tx output
• 5V tolerant logic input when VCC ≤5V