Features
■ Ultra low top and bottom junction to case
thermal resistance
■ Extremely low on-resistance RDS(on)
■ RDS(on)*Qg industry benchmark
■ High avalanche ruggedness
■ Fully encapsulated die
■ 100% Matte tin finish (in compliance with the
2002/95/EC european directive)
■ PolarPAK® is a trademark of VISHAY

Application
■ Switching applications

Description
This product utilizes the 5th generation of design
rules of ST’s proprietary STripFET™ technology.
The lowest available RDS(on)*Qg, in this chip scale
package, makes this device suitable for the most
demanding DC-DC converter applications, where
high power density is to be achieved.