The **TMPC0312H-R36MG** is a high-performance, surface-mount (SMD) power inductor commonly used in DC-DC converters, mobile devices, and high-current power supplies. It belongs to a class of "molded" inductors designed for high efficiency and low electromagnetic interference (EMI). --- ## 1. Technical Specifications | Parameter | Value / Specification | | :--- | :--- | | **Inductance** | 0.36 µH | | **Tolerance** | ±20% (indicated by 'M') | | **Case Size** | 0312 (approx. 3.2 x 3.0 x 1.2 mm) | | **DC Resistance (DCR)** | Typ: 9.5 mΩ / Max: 11.4 mΩ | | **Saturation Current (Isat)** | ~11.0 A (drops inductance by 30%) | | **Heating Current (Irms)** | ~7.5 A (causes 40°C temp rise) | | **Operating Temperature** | -40°C to +125°C | --- ## 2. Key Features & Construction ### A. Metal Alloy Core Unlike traditional ferrite inductors, the TMPC series uses a **metallic powder core**. - **Soft Saturation:** The inductance decreases gradually as current increases, rather than dropping off sharply (hard saturation). - **High Power Density:** Allows for high current handling in a very small physical footprint. ### B. Shielded Design The part is magnetically shielded. The coil is molded directly into the metal powder body, which minimizes leakage flux and reduces EMI, making it ideal for noise-sensitive circuits. ### C. Low DCR The low direct-current resistance (DCR) minimizes power loss due to heat, significantly improving the overall efficiency of the power stage. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in selecting alternatives or identifying characteristics: | Code Segment | Meaning | | :--- | :--- | | **TMPC** | Series name (Molded Power Inductor) | | **0312** | Dimensions (3.2mm length x 3.0mm width x 1.2mm height) | | **H** | High current / High performance grade | | **R36** | Inductance value (R36 = 0.36 µH) | | **M** | Tolerance (M = ±20%) | | **G** | Green/RoHS Compliant | --- ## 4. Common Applications * **DC-DC Converters:** Point-of-load (POL) modules for CPUs and GPUs. * **Mobile Electronics:** Smartphones and tablets where height (1.2mm) is restricted. * **Laptops:** Power rails for SSDs or DDR memory. * **Automotive/Industrial:** Compact sensors and communication modules.