The **ATS-11B-180-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed specifically for cooling integrated circuits (ICs) and surface-mount components. --- ### 1. Technical Specifications The part number encodes specific mechanical and thermal properties. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins / Steel Springs) | | **Thermal Resistance** | ~4.80°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 22.86mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Design The heat sink features a **tapered fin design**. Unlike standard square-cut fins, these spread outward to maximize the surface area for heat dissipation while minimizing the pressure drop. This allows for more efficient cooling in systems with limited airflow. #### B. pushPIN™ Attachment System The **"R0"** suffix usually refers to the specific attachment kit included. The pushPIN™ system provides: * **Constant Pressure:** A compression spring ensures a firm, uniform contact between the heat sink and the electronic chip. * **Secure Mounting:** It uses pre-drilled holes in the PCB, making it much more secure than adhesive-based thermal tapes, especially in high-vibration environments. #### C. Thermal Interface Material (TIM) The unit comes with **ATS-T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink to ensure maximum heat transfer. --- ### 3. Typical Applications This part is commonly used to cool high-heat generating components on Printed Circuit Boards (PCBs), including: * **Processors:** CPUs, GPUs, and high-end FPGAs. * **Network Hardware:** Chips in routers, switches, and base stations. * **Power Electronics:** Voltage regulators and high-density power modules. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.80 | | 400 (2.0 m/s) | 3.20 | | 600 (3.0 m/s) | 2.10 | ---