The **ATS-10E-145-C1-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Component Overview This part belongs to the **maxiFLOW™** series, known for its patented flared fin design which maximizes airflow and cooling efficiency in constrained spaces. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10E-145-C1-R0 | | **Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 25.00 mm (Vertical profile from the base) * **Fin Pitch:** Fine/Flared --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the semiconductor (CPU, GPU, or FPGA). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 2.88 | | **200 LFM (1.0 m/s)** | 1.68 | | **500 LFM (2.5 m/s)** | 1.13 | --- ### 4. Key Electronic & Mechanical Features 1. **pushPIN™ Attachment:** The "-R0" suffix indicates the use of a push-pin and brass spring mechanism. This provides the necessary "TIM" (Thermal Interface Material) pressure to ensure optimal contact with the electronic chip. 2. **Blue Anodized Finish:** The surface treatment is not just for aesthetics; it increases surface emissivity and provides corrosion resistance for the aluminum. 3. **Cross-Cut Fin Design:** The flared fins allow for multidirectional airflow, meaning it performs well even if the air is not hitting it perfectly straight (turbulent air). 4. **Pre-Applied TIM:** These units usually come with a high-performance thermal phase-change material pre-applied to the base to simplify assembly. --- ### 5. Common Applications This heat sink is typically found in high-heat density electronic environments: * **Networking Gear:** Routers, switches, and base stations. * **Power Supplies:** Cooling MOSFETs or power transistors. * **Embedded Computing:** Cooling industrial-grade processors.