The **ATS-08F-17-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application. ### 1. General Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). It is characterized by its "Fine Pitch" design which maximizes surface area for heat dissipation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08F-17-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 15.44°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heatsink fits within the PCB layout without interfering with adjacent electronic components. | Dimension | Value | | :--- | :--- | | **Length / Width** | 54.00 mm x 54.00 mm | | **Height** | 12.70 mm | | **Fin Pitch** | Fine | | **Fin Pattern** | XCUT | --- ### 3. Electronic & Thermal Performance The "C2" in the part number indicates the thermal interface material and performance level. * **Thermal Interface Material (TIM):** This model typically comes pre-applied with **T766**, a high-performance thermal grease that ensures low contact resistance between the semiconductor die and the aluminum base. * **Airflow Efficiency:** The XCUT design allows for multi-directional airflow, making it ideal for densely packed electronic enclosures where air may not flow in a single straight path. * **Pressure Application:** The pushPIN™ system uses a precise spring-force mechanism. This ensures that the heatsink maintains constant pressure on the electronic chip, preventing air gaps caused by thermal expansion or vibration. --- ### 4. Typical Applications This specific heatsink is commonly used for cooling the following electronic parts: 1. **CPUs/GPUs:** Small form-factor processors. 2. **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. 3. **ASICs:** Application-Specific Integrated Circuits in telecommunications or networking gear. 4. **Power Transistors:** High-power MOSFET arrays.