The **ATS-04A-206-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series, designed specifically for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Heat Sink Type** | XCUT (Cross-Cut) | | **Attachment Method** | Push Pin (Plastic) / Brass Spring | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance** | 7.67 °C/W (at 200 LFM) | | **Flow Orientation** | Omnidirectional (Cross-cut fins) | --- ## 2. Key Electronic Features ### A. XCUT Fin Design Unlike traditional straight-fin heat sinks, the XCUT design features fins that are cut both horizontally and vertically. * **Omnidirectional Airflow:** This allows the heat sink to be mounted in any orientation without losing cooling efficiency, making it ideal for electronic enclosures where airflow direction might vary. * **Increased Surface Area:** The cross-cut pattern increases the total surface area available for convection. ### B. Attachment Mechanism The "Push Pin" system is designed to provide consistent pressure on the electronic component (IC/Chip): * **Mechanical Stability:** The plastic push pins are paired with a compression spring to ensure the heat sink remains flat against the chip. * **Shock and Vibration Resistance:** This mounting method is safer for mobile or industrial electronics than simple adhesive tapes, as it prevents the heat sink from shifting during movement. ### C. Thermal Interface Material (TIM) * **Phase Change Material:** This specific model usually comes with **Saint-Gobain C675** or a similar high-performance thermal pad pre-applied to the base. * **Purpose:** The TIM fills the microscopic air gaps between the chip surface and the aluminum base to maximize heat transfer. --- ## 3. Applications This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators.