The **ATS-04A-200-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications, electronic application, and technical characteristics. --- ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04A-200-C1-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | ### 2. Physical Dimensions This heat sink is designed for medium-to-large electronic components (like FPGAs or CPUs) that require robust cooling. * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height (Fin Height):** 10.00 mm * **Pin Pitch:** 43.00 mm ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the silicon die. It is measured in degrees Celsius per Watt (°C/W) based on Airflow (LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 9.76 | | **400 LFM (2.0 m/s)** | 3.37 | | **700 LFM (3.5 m/s)** | 2.52 | ### 4. Key Electronic & Mechanical Features * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a permanent mechanical attachment. The push-pins have a built-in spring that provides precise "Firm Attachment Force" to ensure optimal contact with the electronic chip. * **Straight-Fin Design:** The fins are arranged in a straight-cut pattern, which is optimized for **forced-air cooling** (systems with fans). * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. * **Material Composition:** Made from Aluminum AL6063, which offers high thermal conductivity while remaining lightweight for PCB safety. ### 5. Common Applications This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed network processors. 2. **Embedded Systems:** For industrial Motherboards or SoCs. 3. **Power Electronics:** Dissipating heat from high-power MOSFETs or IGPT modules. ---