The **ATS-02D-115-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.30°C/W (at 100 LFM) | | **Fin Pattern** | COARSE-PITCH (Straight fin) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System The "02D" designation indicates it uses a specific spring-loaded pin mechanism. * **Purpose:** Provides consistent pressure on the component (TIM compression) and ensures the heat sink stays securely attached during shocks or vibrations. * **Benefit:** Requires pre-drilled holes in the PCB, eliminating the need for adhesives that can degrade over time. #### B. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity, which slightly enhances radiative cooling. #### C. Thermal Interface Material (TIM) The "C1" in the part number indicates the type of thermal interface material pre-applied to the base. * **Type:** Usually a high-performance thermal pad or phase-change material. * **Function:** Fills microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink is highly dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Static)** | 5.30 | | **300 (Active)** | 2.50 | | **500 (High)** | 1.90 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Typical Applications * **Network Switches/Routers:** For cooling ASICs. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Supplies:** Cooling MOSFETs or voltage regulators.